Deposition of copper coatings in a magnetron with liquid target

Copper coatings were deposited on monocrystalline Si substrates using a magnetron discharge with a liquid cathode in the metal vapour plasma. During the deposition, the bias voltage in the range from 0 V to–400 V was applied to the substrate. The prepared films were investigated by a scanning electr...

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Veröffentlicht in:	Physics of atomic nuclei 2015-12, Vol.78 (14), p.1674-1676
Hauptverfasser:	Tumarkin, A. V., Kaziev, A. V., Kolodko, D. V., Pisarev, A. A., Kharkov, M. M., Khodachenko, G. V.
Format:	Artikel
Sprache:	eng
Schlagworte:	ADHESION ADHESIVES CATHODES COATINGS CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY COPPER DEPOSITION Dielectric films ELECTRIC POTENTIAL Interaction of Plasmas LIQUIDS MAGNETRONS Particle and Nuclear Physics Particle Beams Physics Physics and Astronomy PLASMA Radiation with Matter SCANNING ELECTRON MICROSCOPY SILICON SUBSTRATES Thin films VAPORS
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Zusammenfassung:	Copper coatings were deposited on monocrystalline Si substrates using a magnetron discharge with a liquid cathode in the metal vapour plasma. During the deposition, the bias voltage in the range from 0 V to–400 V was applied to the substrate. The prepared films were investigated by a scanning electron microscope, and their adhesive properties were studied using a scratch tester. It was demonstrated that the adhesion of the deposited films strongly depends on the bias voltage and varies in a wide range.
ISSN:	1063-7788 1562-692X
DOI:	10.1134/S1063778815140136