Atom chips on direct bonded copper substrates

Atom chips on direct bonded copper substrates

We present the use of direct bonded copper (DBC) for the straightforward fabrication of high power atom chips. Atom chips using DBC have several benefits: excellent copper/substrate adhesion, high purity, thick (>100μm) copper layers, high substrate thermal conductivity, high aspect ratio wires,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Review of scientific instruments 2011-02, Vol.82 (2), p.023101-023101-7
Hauptverfasser: Squires, Matthew B., Stickney, James A., Carlson, Evan J., Baker, Paul M., Buchwald, Walter R., Wentzell, Sandra, Miller, Steven M.
Format: Artikel
Sprache:eng
Schlagworte:
ADHESION
ASPECT RATIO
CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY
COOLING
COPPER
ELECTRIC CURRENTS
ELECTRONIC EQUIPMENT
ETCHING
FABRICATION
IMPEDANCE
INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND TECHNOLOGY
MAGNETIC FIELDS
RUBIDIUM 87
SUBSTRATES
THERMAL CONDUCTIVITY
TRAPS
WIRES
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:We present the use of direct bonded copper (DBC) for the straightforward fabrication of high power atom chips. Atom chips using DBC have several benefits: excellent copper/substrate adhesion, high purity, thick (>100μm) copper layers, high substrate thermal conductivity, high aspect ratio wires, the potential for rapid (
ISSN:0034-6748
1089-7623
DOI:10.1063/1.3529434