The MAPS foil

We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised “MAPS foil”, is a flexible, light, protected, and fully integrated detector module. B...

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Veröffentlicht in:	Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment Accelerators, spectrometers, detectors and associated equipment, 2023-01, Vol.1046 (C), p.167673, Article 167673
Hauptverfasser:	Beolé, S., Carnesecchi, F., Contin, G., de Oliveira, R., di Mauro, A., Ferry, S., Hillemanns, H., Junique, A., Kluge, A., Lautner, L., Mager, M., Mehl, B., Rebane, K., Reidt, F., Sanna, I., Šuljić, M., Yüncü, A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Monolithic active pixel sensors Solid state detectors
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Beschreibung
Zusammenfassung:	We present a method of embedding a Monolithic Active Pixel Sensor (MAPS) into a flexible printed circuit board (FPC) and its interconnection by means of through-hole copper plating. The resulting assembly, baptised “MAPS foil”, is a flexible, light, protected, and fully integrated detector module. By using widely available printed circuit board manufacturing techniques, the production of these devices can be scaled easily in size and volume, making it a compelling candidate for future large-scale applications. A first series of prototypes that embed the ALPIDE chip has been produced, functionally tested, and shown to be working.
ISSN:	0168-9002 1872-9576
DOI:	10.1016/j.nima.2022.167673