High n-type conductivity and carrier concentration in Si-implanted homoepitaxial AlN
We demonstrate Si-implanted AlN with high conductivity (>1 Ω-1 cm-1) and high carrier concentration (5 × 1018 cm-3). This was enabled by Si implantation into AlN with a low threading dislocation density (TDD) (
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Veröffentlicht in: | Applied physics letters 2021-03, Vol.118 (11) |
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creator | Breckenridge, M. Hayden Bagheri, Pegah Guo, Qiang Sarkar, Biplab Khachariya, Dolar Pavlidis, Spyridon Tweedie, James Kirste, Ronny Mita, Seiji Reddy, Pramod Collazo, Ramón Sitar, Zlatko |
description | We demonstrate Si-implanted AlN with high conductivity (>1 Ω-1 cm-1) and high carrier concentration (5 × 1018 cm-3). This was enabled by Si implantation into AlN with a low threading dislocation density (TDD) ( |
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Hayden ; Bagheri, Pegah ; Guo, Qiang ; Sarkar, Biplab ; Khachariya, Dolar ; Pavlidis, Spyridon ; Tweedie, James ; Kirste, Ronny ; Mita, Seiji ; Reddy, Pramod ; Collazo, Ramón ; Sitar, Zlatko</creator><creatorcontrib>Breckenridge, M. Hayden ; Bagheri, Pegah ; Guo, Qiang ; Sarkar, Biplab ; Khachariya, Dolar ; Pavlidis, Spyridon ; Tweedie, James ; Kirste, Ronny ; Mita, Seiji ; Reddy, Pramod ; Collazo, Ramón ; Sitar, Zlatko ; Adroit Materials, Cary, NC (United States) ; North Carolina State Univ., Raleigh, NC (United States)</creatorcontrib><description>We demonstrate Si-implanted AlN with high conductivity (>1 Ω-1 cm-1) and high carrier concentration (5 × 1018 cm-3). This was enabled by Si implantation into AlN with a low threading dislocation density (TDD) (<103 cm-2), a non-equilibrium damage recovery and dopant activation annealing process, and in situ suppression of self-compensation during the annealing. Low TDD and active suppression of VAl-nSiAl complexes via defect quasi Fermi level control enabled low compensation, while low-temperature, non-equilibrium annealing maintained the desired shallow donor state with an ionization energy of ~70 meV. 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Hayden</creatorcontrib><creatorcontrib>Bagheri, Pegah</creatorcontrib><creatorcontrib>Guo, Qiang</creatorcontrib><creatorcontrib>Sarkar, Biplab</creatorcontrib><creatorcontrib>Khachariya, Dolar</creatorcontrib><creatorcontrib>Pavlidis, Spyridon</creatorcontrib><creatorcontrib>Tweedie, James</creatorcontrib><creatorcontrib>Kirste, Ronny</creatorcontrib><creatorcontrib>Mita, Seiji</creatorcontrib><creatorcontrib>Reddy, Pramod</creatorcontrib><creatorcontrib>Collazo, Ramón</creatorcontrib><creatorcontrib>Sitar, Zlatko</creatorcontrib><creatorcontrib>Adroit Materials, Cary, NC (United States)</creatorcontrib><creatorcontrib>North Carolina State Univ., Raleigh, NC (United States)</creatorcontrib><title>High n-type conductivity and carrier concentration in Si-implanted homoepitaxial AlN</title><title>Applied physics letters</title><description>We demonstrate Si-implanted AlN with high conductivity (>1 Ω-1 cm-1) and high carrier concentration (5 × 1018 cm-3). This was enabled by Si implantation into AlN with a low threading dislocation density (TDD) (<103 cm-2), a non-equilibrium damage recovery and dopant activation annealing process, and in situ suppression of self-compensation during the annealing. Low TDD and active suppression of VAl-nSiAl complexes via defect quasi Fermi level control enabled low compensation, while low-temperature, non-equilibrium annealing maintained the desired shallow donor state with an ionization energy of ~70 meV. The realized n-type conductivity and carrier concentration are over one order of magnitude higher than that reported thus far and present a major technological breakthrough in doping of AlN.</description><subject>CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS</subject><issn>0003-6951</issn><issn>1077-3118</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><recordid>eNqNjMsKwjAUBYMoWB__ENwHEkPauhRRunJj9xLSaK-kSUmuYv_eCn6Aq8Mww5mQTPCiYFKIckoyzrlk-U6JOVmk9BhRbaXMSF3BvaWe4dBbaoJvngbhBThQ7RtqdIxg41cY6zFqhOApeHoBBl3vtEfb0DZ0wfaA-g3a0b07r8jspl2y698uyeZ0rA8VCwnhmgygNe346a3BqyiVUHkh_4o-MEhCAQ</recordid><startdate>20210316</startdate><enddate>20210316</enddate><creator>Breckenridge, M. 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Hayden</au><au>Bagheri, Pegah</au><au>Guo, Qiang</au><au>Sarkar, Biplab</au><au>Khachariya, Dolar</au><au>Pavlidis, Spyridon</au><au>Tweedie, James</au><au>Kirste, Ronny</au><au>Mita, Seiji</au><au>Reddy, Pramod</au><au>Collazo, Ramón</au><au>Sitar, Zlatko</au><aucorp>Adroit Materials, Cary, NC (United States)</aucorp><aucorp>North Carolina State Univ., Raleigh, NC (United States)</aucorp><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>High n-type conductivity and carrier concentration in Si-implanted homoepitaxial AlN</atitle><jtitle>Applied physics letters</jtitle><date>2021-03-16</date><risdate>2021</risdate><volume>118</volume><issue>11</issue><issn>0003-6951</issn><eissn>1077-3118</eissn><abstract>We demonstrate Si-implanted AlN with high conductivity (>1 Ω-1 cm-1) and high carrier concentration (5 × 1018 cm-3). This was enabled by Si implantation into AlN with a low threading dislocation density (TDD) (<103 cm-2), a non-equilibrium damage recovery and dopant activation annealing process, and in situ suppression of self-compensation during the annealing. Low TDD and active suppression of VAl-nSiAl complexes via defect quasi Fermi level control enabled low compensation, while low-temperature, non-equilibrium annealing maintained the desired shallow donor state with an ionization energy of ~70 meV. 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source | AIP Journals Complete; Alma/SFX Local Collection |
subjects | CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS |
title | High n-type conductivity and carrier concentration in Si-implanted homoepitaxial AlN |
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