Phase field modeling of rapid resolidification of Al-Cu thin films

•Rapid solidification phase field simulations were compared to time-resolved images.•Phase field model convergence in rapid solidification was investigated.•Predicted morphological features were in good agreement with the experiments. A binary alloy multi-order parameter phase field model is used to study rapid solidification in Al-Cu under conditions corresponding to recent dynamic transmission electron microscopy (DTEM) experiments. The phase field model’s sharp interface limit is set through a recent matched asymptotic analysis to follow the solute trapping and interface undercooling kinetics of the Continuous Growth Model (CGM). The phase field model convergence to the CGM sharp interface model is investigated, and based on this an optimal interface width is chosen to simulate the DTEM experimental conditions. The temperature distribution used in the phase field simulations is taken from an analytic expression extracted from experiments. Simulated solidification structures are compared to experiments, including time-resolved DTEM images and post-mortem TEM-based image quality and orientation maps. We find that the large scale morphological features of the simulated microstructures are in good agreement with the experiments, and the corresponding concentration profiles that emerge are in qualitative agreement with experiments. These results show that phase field simulations, informed with DTEM experiments, provides a promising framework to investigate rapidly solidified microstructure evolution and solute segregation, and to calibrate hard-to-determine solidification parameters.