Modulating the thermal conductivity in hexagonal boron nitride via controlled boron isotope concentration

Hexagonal boron nitride (h-BN) has been predicted to exhibit an in-plane thermal conductivity as high as ~ 550 W m −1 K −1 at room temperature, making it a promising thermal management material. However, current experimental results (220–420 W m −1 K −1 ) have been well below the prediction. Here, w...

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Veröffentlicht in:Communications physics 2019-05, Vol.2 (1), Article 43
Hauptverfasser: Yuan, Chao, Li, Jiahan, Lindsay, Lucas, Cherns, David, Pomeroy, James W., Liu, Song, Edgar, James H., Kuball, Martin
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Sprache:eng
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Zusammenfassung:Hexagonal boron nitride (h-BN) has been predicted to exhibit an in-plane thermal conductivity as high as ~ 550 W m −1 K −1 at room temperature, making it a promising thermal management material. However, current experimental results (220–420 W m −1 K −1 ) have been well below the prediction. Here, we report on the modulation of h-BN thermal conductivity by controlling the B isotope concentration. For monoisotopic 10 B h-BN, an in-plane thermal conductivity as high as 585 W m −1 K −1 is measured at room temperature, ~ 80% higher than that of h-BN with a disordered isotope concentration (52%:48% mixture of 10 B and 11 B). The temperature-dependent thermal conductivities of monoisotopic h-BN agree well with first principles calculations including only intrinsic phonon-phonon scattering. Our results illustrate the potential to achieve high thermal conductivity in h-BN and control its thermal conductivity, opening avenues for the wide application of h-BN as a next-generation thin-film material for thermal management, metamaterials and metadevices. Hexagonal boron nitride has been theoretically predicted to have high values for its thermal conductivity which would make it useful for thermal management of devices but these values have not been experimentally achieved. The authors manipulate the isotope concentration of B to increase the thermal conductivity and reach these predicted values.
ISSN:2399-3650
2399-3650
DOI:10.1038/s42005-019-0145-5