Thin Film Thermoelectric Metal-Organic Framework with High Seebeck Coefficient and Low Thermal Conductivity
A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal–organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.
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Veröffentlicht in: | Advanced materials (Weinheim) 2015-06, Vol.27 (22), p.3453-3459 |
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Hauptverfasser: | , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
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Online-Zugang: | Volltext |
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Zusammenfassung: | A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal–organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials. |
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ISSN: | 0935-9648 1521-4095 |
DOI: | 10.1002/adma.201501078 |