Thin Film Thermoelectric Metal-Organic Framework with High Seebeck Coefficient and Low Thermal Conductivity

A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal–organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.

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Veröffentlicht in:Advanced materials (Weinheim) 2015-06, Vol.27 (22), p.3453-3459
Hauptverfasser: Erickson, Kristopher J., Léonard, François, Stavila, Vitalie, Foster, Michael E., Spataru, Catalin D., Jones, Reese E., Foley, Brian M., Hopkins, Patrick E., Allendorf, Mark D., Talin, A. Alec
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Sprache:eng
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Zusammenfassung:A new thermoelectric material with high Seebeck coefficient and low thermal conductivity is demonstrated based on an electrically conducting metal–organic framework (MOF) using the guest@MOF concept. This demonstration opens a new avenue for the future development of thermoelectric materials.
ISSN:0935-9648
1521-4095
DOI:10.1002/adma.201501078