Plasticized Polymer Interlayer for Low-Temperature Fabrication of a High-Quality Silver Nanowire-Based Flexible Transparent and Conductive Film
Silver nanowires (AgNWs) are one of the most promising materials to replace commercially available indium tin oxide in flexible transparent conductive films (TCFs); however, there are still numerous problems originating from poor AgNW junction formation and improper AgNW embedment into transparent s...
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Veröffentlicht in: | ACS applied materials & interfaces 2017-05, Vol.9 (17), p.15114-15121 |
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creator | Jo, Wonhee Kang, Hong Suk Choi, Jaeho Lee, Hongkyung Kim, Hee-Tak |
description | Silver nanowires (AgNWs) are one of the most promising materials to replace commercially available indium tin oxide in flexible transparent conductive films (TCFs); however, there are still numerous problems originating from poor AgNW junction formation and improper AgNW embedment into transparent substrates. To mitigate these problems, high-temperature processes have been adopted; however, unwanted substrate deformation prevents the use of these processes for the formation of flexible TCFs. In this work, we present a novel poly(methyl methacrylate) interlayer plasticized by dibutyl phthalate for low-temperature fabrication of AgNW-based TCFs, which does not cause any substrate deformation. By exploiting the viscoelastic properties of the plasticized interlayer near the lowered glass-transition temperature, a monolithic junction of AgNWs on the interlayer and embedment of the interconnected AgNWs into the interlayer are achieved in a single-step pressing. The resulting AgNW-TCFs are highly transparent (∼92% at a wavelength of 550 nm), highly conductive ( |
doi_str_mv | 10.1021/acsami.7b01344 |
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fullrecord | <record><control><sourceid>proquest_osti_</sourceid><recordid>TN_cdi_osti_scitechconnect_1371977</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1884168579</sourcerecordid><originalsourceid>FETCH-LOGICAL-a423t-4b066fe47d408d3e6fdf805c2798c11607a88a532d6bc28c9802216e626983d83</originalsourceid><addsrcrecordid>eNp1kU1v1DAQhiMEoh9w5YgsTggpi-04jnOkK7attIIilnM0cSbUlWMvttOy_An-MkZZeuM0c3jeR5p5i-IVoytGOXsPOsJkVk1PWSXEk-KUtUKUitf86eMuxElxFuMdpbLitH5enHBVNaJu2tPi942FmIw2v3AgN94eJgzk2iUMFg55HX0gW_9Q7nDaY4A0ByQb6IPRkIx3xI8EyJX5flt-mcGadCBfjb3PwU_g_IMJWF5AzOqNxZ-mt0h2AVzcQ0CXCLiBrL0bZp3MffYaO70ono1gI748zvPi2-bjbn1Vbj9fXq8_bEsQvEql6KmUI4pmEFQNFcpxGBWtNW9apRmTtAGloK74IHvNlW4V5ZxJlFy2qhpUdV68Wbw-X99FbRLqW-2dQ506VjWsbZoMvV2gffA_Zoypm0zUaC049HPsmFKCSZUfmdHVgurgYww4dvtgJgiHjtHub1Pd0lR3bCoHXh_dcz_h8Ij_qyYD7xYgB7s7PweX__E_2x9ZkZ73</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1884168579</pqid></control><display><type>article</type><title>Plasticized Polymer Interlayer for Low-Temperature Fabrication of a High-Quality Silver Nanowire-Based Flexible Transparent and Conductive Film</title><source>American Chemical Society Journals</source><creator>Jo, Wonhee ; Kang, Hong Suk ; Choi, Jaeho ; Lee, Hongkyung ; Kim, Hee-Tak</creator><creatorcontrib>Jo, Wonhee ; Kang, Hong Suk ; Choi, Jaeho ; Lee, Hongkyung ; Kim, Hee-Tak ; Pacific Northwest National Lab. (PNNL), Richland, WA (United States)</creatorcontrib><description>Silver nanowires (AgNWs) are one of the most promising materials to replace commercially available indium tin oxide in flexible transparent conductive films (TCFs); however, there are still numerous problems originating from poor AgNW junction formation and improper AgNW embedment into transparent substrates. To mitigate these problems, high-temperature processes have been adopted; however, unwanted substrate deformation prevents the use of these processes for the formation of flexible TCFs. In this work, we present a novel poly(methyl methacrylate) interlayer plasticized by dibutyl phthalate for low-temperature fabrication of AgNW-based TCFs, which does not cause any substrate deformation. By exploiting the viscoelastic properties of the plasticized interlayer near the lowered glass-transition temperature, a monolithic junction of AgNWs on the interlayer and embedment of the interconnected AgNWs into the interlayer are achieved in a single-step pressing. The resulting AgNW-TCFs are highly transparent (∼92% at a wavelength of 550 nm), highly conductive (<90 Ω/sq), and environmentally and mechanically robust. Therefore, the plasticized interlayer provides a simple and effective route to fabricate high-quality AgNW-based TCFs.</description><identifier>ISSN: 1944-8244</identifier><identifier>EISSN: 1944-8252</identifier><identifier>DOI: 10.1021/acsami.7b01344</identifier><identifier>PMID: 28374579</identifier><language>eng</language><publisher>United States: American Chemical Society</publisher><subject>MATERIALS SCIENCE</subject><ispartof>ACS applied materials & interfaces, 2017-05, Vol.9 (17), p.15114-15121</ispartof><rights>Copyright © 2017 American Chemical Society</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-a423t-4b066fe47d408d3e6fdf805c2798c11607a88a532d6bc28c9802216e626983d83</citedby><cites>FETCH-LOGICAL-a423t-4b066fe47d408d3e6fdf805c2798c11607a88a532d6bc28c9802216e626983d83</cites><orcidid>0000-0003-4578-5422 ; 0000000345785422</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://pubs.acs.org/doi/pdf/10.1021/acsami.7b01344$$EPDF$$P50$$Gacs$$H</linktopdf><linktohtml>$$Uhttps://pubs.acs.org/doi/10.1021/acsami.7b01344$$EHTML$$P50$$Gacs$$H</linktohtml><link.rule.ids>230,314,776,780,881,2752,27053,27901,27902,56713,56763</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/28374579$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink><backlink>$$Uhttps://www.osti.gov/biblio/1371977$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Jo, Wonhee</creatorcontrib><creatorcontrib>Kang, Hong Suk</creatorcontrib><creatorcontrib>Choi, Jaeho</creatorcontrib><creatorcontrib>Lee, Hongkyung</creatorcontrib><creatorcontrib>Kim, Hee-Tak</creatorcontrib><creatorcontrib>Pacific Northwest National Lab. (PNNL), Richland, WA (United States)</creatorcontrib><title>Plasticized Polymer Interlayer for Low-Temperature Fabrication of a High-Quality Silver Nanowire-Based Flexible Transparent and Conductive Film</title><title>ACS applied materials & interfaces</title><addtitle>ACS Appl. Mater. Interfaces</addtitle><description>Silver nanowires (AgNWs) are one of the most promising materials to replace commercially available indium tin oxide in flexible transparent conductive films (TCFs); however, there are still numerous problems originating from poor AgNW junction formation and improper AgNW embedment into transparent substrates. To mitigate these problems, high-temperature processes have been adopted; however, unwanted substrate deformation prevents the use of these processes for the formation of flexible TCFs. In this work, we present a novel poly(methyl methacrylate) interlayer plasticized by dibutyl phthalate for low-temperature fabrication of AgNW-based TCFs, which does not cause any substrate deformation. By exploiting the viscoelastic properties of the plasticized interlayer near the lowered glass-transition temperature, a monolithic junction of AgNWs on the interlayer and embedment of the interconnected AgNWs into the interlayer are achieved in a single-step pressing. The resulting AgNW-TCFs are highly transparent (∼92% at a wavelength of 550 nm), highly conductive (<90 Ω/sq), and environmentally and mechanically robust. Therefore, the plasticized interlayer provides a simple and effective route to fabricate high-quality AgNW-based TCFs.</description><subject>MATERIALS SCIENCE</subject><issn>1944-8244</issn><issn>1944-8252</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><recordid>eNp1kU1v1DAQhiMEoh9w5YgsTggpi-04jnOkK7attIIilnM0cSbUlWMvttOy_An-MkZZeuM0c3jeR5p5i-IVoytGOXsPOsJkVk1PWSXEk-KUtUKUitf86eMuxElxFuMdpbLitH5enHBVNaJu2tPi942FmIw2v3AgN94eJgzk2iUMFg55HX0gW_9Q7nDaY4A0ByQb6IPRkIx3xI8EyJX5flt-mcGadCBfjb3PwU_g_IMJWF5AzOqNxZ-mt0h2AVzcQ0CXCLiBrL0bZp3MffYaO70ono1gI748zvPi2-bjbn1Vbj9fXq8_bEsQvEql6KmUI4pmEFQNFcpxGBWtNW9apRmTtAGloK74IHvNlW4V5ZxJlFy2qhpUdV68Wbw-X99FbRLqW-2dQ506VjWsbZoMvV2gffA_Zoypm0zUaC049HPsmFKCSZUfmdHVgurgYww4dvtgJgiHjtHub1Pd0lR3bCoHXh_dcz_h8Ij_qyYD7xYgB7s7PweX__E_2x9ZkZ73</recordid><startdate>20170503</startdate><enddate>20170503</enddate><creator>Jo, Wonhee</creator><creator>Kang, Hong Suk</creator><creator>Choi, Jaeho</creator><creator>Lee, Hongkyung</creator><creator>Kim, Hee-Tak</creator><general>American Chemical Society</general><general>American Chemical Society (ACS)</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7X8</scope><scope>OTOTI</scope><orcidid>https://orcid.org/0000-0003-4578-5422</orcidid><orcidid>https://orcid.org/0000000345785422</orcidid></search><sort><creationdate>20170503</creationdate><title>Plasticized Polymer Interlayer for Low-Temperature Fabrication of a High-Quality Silver Nanowire-Based Flexible Transparent and Conductive Film</title><author>Jo, Wonhee ; Kang, Hong Suk ; Choi, Jaeho ; Lee, Hongkyung ; Kim, Hee-Tak</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-a423t-4b066fe47d408d3e6fdf805c2798c11607a88a532d6bc28c9802216e626983d83</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>MATERIALS SCIENCE</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Jo, Wonhee</creatorcontrib><creatorcontrib>Kang, Hong Suk</creatorcontrib><creatorcontrib>Choi, Jaeho</creatorcontrib><creatorcontrib>Lee, Hongkyung</creatorcontrib><creatorcontrib>Kim, Hee-Tak</creatorcontrib><creatorcontrib>Pacific Northwest National Lab. (PNNL), Richland, WA (United States)</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><collection>MEDLINE - Academic</collection><collection>OSTI.GOV</collection><jtitle>ACS applied materials & interfaces</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Jo, Wonhee</au><au>Kang, Hong Suk</au><au>Choi, Jaeho</au><au>Lee, Hongkyung</au><au>Kim, Hee-Tak</au><aucorp>Pacific Northwest National Lab. (PNNL), Richland, WA (United States)</aucorp><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Plasticized Polymer Interlayer for Low-Temperature Fabrication of a High-Quality Silver Nanowire-Based Flexible Transparent and Conductive Film</atitle><jtitle>ACS applied materials & interfaces</jtitle><addtitle>ACS Appl. Mater. Interfaces</addtitle><date>2017-05-03</date><risdate>2017</risdate><volume>9</volume><issue>17</issue><spage>15114</spage><epage>15121</epage><pages>15114-15121</pages><issn>1944-8244</issn><eissn>1944-8252</eissn><abstract>Silver nanowires (AgNWs) are one of the most promising materials to replace commercially available indium tin oxide in flexible transparent conductive films (TCFs); however, there are still numerous problems originating from poor AgNW junction formation and improper AgNW embedment into transparent substrates. To mitigate these problems, high-temperature processes have been adopted; however, unwanted substrate deformation prevents the use of these processes for the formation of flexible TCFs. In this work, we present a novel poly(methyl methacrylate) interlayer plasticized by dibutyl phthalate for low-temperature fabrication of AgNW-based TCFs, which does not cause any substrate deformation. By exploiting the viscoelastic properties of the plasticized interlayer near the lowered glass-transition temperature, a monolithic junction of AgNWs on the interlayer and embedment of the interconnected AgNWs into the interlayer are achieved in a single-step pressing. The resulting AgNW-TCFs are highly transparent (∼92% at a wavelength of 550 nm), highly conductive (<90 Ω/sq), and environmentally and mechanically robust. Therefore, the plasticized interlayer provides a simple and effective route to fabricate high-quality AgNW-based TCFs.</abstract><cop>United States</cop><pub>American Chemical Society</pub><pmid>28374579</pmid><doi>10.1021/acsami.7b01344</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0003-4578-5422</orcidid><orcidid>https://orcid.org/0000000345785422</orcidid></addata></record> |
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title | Plasticized Polymer Interlayer for Low-Temperature Fabrication of a High-Quality Silver Nanowire-Based Flexible Transparent and Conductive Film |
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