Recent progress of RD53 Collaboration towards next generation Pixel Read-Out Chip for HL-LHC

This paper is a review of recent progress of RD53 Collaboration. Results obtained onthe study of the radiation effects on 65 nm CMOS have matured enough to define first strategies toadopt in the design of analog and digital circuits. Critical building blocks and analog very frontend chains have been designed, tested before and after 5–800 Mrad. Small prototypes of 64 64pixels with complex digital architectures have been produced, and point to address the main issuesof dealing with extremely high pixel rates, while operating at very small in-time thresholds in theanalog front end. The collaboration is now proceeding at full speed towards the design of a largescale prototype, called RD53A, in 65 nm CMOS technology