A single asperity study of Au/Au electrical contacts

Interfacial force microscopy (IFM) is used to measure the electrical contact properties of electroplated gold thin films of the type used in microelectromechanical system relays. Force and current levels consistent with those present in metal-metal contact switches are examined in an atmospheric-pressure, dry-nitrogen ambient at room temperature, and the nature of a nonmetallic contamination layer which limits contact resistance and lifetime is explicitly examined mechanically, electrically and chemically. The electrical and mechanical properties of the contamination layer on the gold substrate are observed by IFM both before and after being exposed to ozone for an extended period of time. The contamination film is characterized by x-ray photoelectron spectroscopy and time-of-flight secondary ion mass spectrometry, and found to consist mostly of hydrocarbons; the film remains relatively stable in both composition and thickness following ozonation. However, some subtle chemical changes in the contamination layer induced by the ozonation process are found to profoundly affect the electrical properties of the gold-gold contact, reducing the resistance by more than 3 orders of magnitude and considerably reducing variability in the contact resistance between contact events. These results clearly demonstrate the critical role both positive and negative of the latent contamination present on the contact surfaces.