Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology

Low-Temperature Insertion Bonding using Electroless Cu-Co-P Micro-Cones Array with Controllable Morphology

Probable mechanisms for low-temperature insertion bonding were discussed. Graphical abstract

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Bibliographische Detailangaben
Veröffentlicht in:Electronic materials letters 2021, 17(6), , pp.459-470
Hauptverfasser: Sun, Yaqian, Wang, Jing, Zhang, Xundi, Yang, Chenlin, Hu, Anmin, Hang, Tao, Wu, Yunwen, Ling, Huiqin, Li, Ming
Format: Artikel
Sprache:eng
Schlagworte:
Bonding
Characterization and Evaluation of Materials
Chemistry and Materials Science
Condensed Matter Physics
Cones
Insertion
Low temperature
Materials Science
Morphology
Nanotechnology
Nanotechnology and Microengineering
Optical and Electronic Materials
Review Paper
전자/정보통신공학
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Beschreibung
Zusammenfassung:Probable mechanisms for low-temperature insertion bonding were discussed. Graphical abstract
ISSN:1738-8090
2093-6788
DOI:10.1007/s13391-021-00302-y