Degradation Mechanism of Interfacial Adhesion between Screen-Printed Ag/Polyimide in Temperature/Humidity Environment

The effect of temperature/humidity (T/H) treatment at 85 ℃/85% relative humidity (R.H.) on the peel strength between screen-printed Ag/polyimide (PI) substrate was evaluated using a 180° peel test. Initial peel strength was 22.22 ± 1.00 gf/mm, and then decreased to 0.47 ± 0.22 gf/mm after 500 h at 8...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Electronic materials letters 2021, 17(2), , pp.157-163
Hauptverfasser:	Bae, Byung-Hyun, Lee, Hyeonchul, Kim, Gahui, Son, Kirak, Park, Young-Bae
Format:	Artikel
Sprache:	eng
Schlagworte:	Boundary layers Characterization and Evaluation of Materials Chemistry and Materials Science Condensed Matter Physics Degradation Humidity Magnetics and Photonics Materials Science Nanotechnology Nanotechnology and Microengineering Optical and Electronic Materials Original Article - Electronics Peel strength Peel tests Relative humidity Substrates Temperature effects 전자/정보통신공학
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The effect of temperature/humidity (T/H) treatment at 85 ℃/85% relative humidity (R.H.) on the peel strength between screen-printed Ag/polyimide (PI) substrate was evaluated using a 180° peel test. Initial peel strength was 22.22 ± 1.00 gf/mm, and then decreased to 0.47 ± 0.22 gf/mm after 500 h at 85 ℃/85% R.H. treatment condition. And, the peeled locus was changed from Ag/PI interface to mixed mode of Ag/PI interface and shallow cohesive inside PI near Ag/PI interface. The decrease in peel strength during T/H treatment is related to formation of weak boundary layer inside PI near Ag/PI interface by hydrolytic degradation of PI due to long-term moisture penetration into the Ag/PI interface. Graphic abstract
ISSN:	1738-8090 2093-6788
DOI:	10.1007/s13391-021-00272-1