W‐Band MMIC chipset in 0.1‐μm mHEMT technology

We developed a 0.1‐μm metamorphic high electron mobility transistor and fabricated a W‐band monolithic microwave integrated circuit chipset with our in‐house technology to verify the performance and usability of the developed technology. The DC characteristics were a drain current density of 747 mA/...

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Veröffentlicht in:ETRI journal 2020, 42(4), , pp.549-561
Hauptverfasser: Lee, Jong‐Min, Chang, Woo‐Jin, Kang, Dong Min, Min, Byoung‐Gue, Yoon, Hyung Sup, Chang, Sung‐Jae, Jung, Hyun‐Wook, Kim, Wansik, Jung, Jooyong, Kim, Jongpil, Seo, Mihui, Kim, Sosu
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Sprache:eng
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Zusammenfassung:We developed a 0.1‐μm metamorphic high electron mobility transistor and fabricated a W‐band monolithic microwave integrated circuit chipset with our in‐house technology to verify the performance and usability of the developed technology. The DC characteristics were a drain current density of 747 mA/mm and a maximum transconductance of 1.354 S/mm; the RF characteristics were a cutoff frequency of 210 GHz and a maximum oscillation frequency of 252 GHz. A frequency multiplier was developed to increase the frequency of the input signal. The fabricated multiplier showed high output values (more than 0 dBm) in the 94 GHz–108 GHz band and achieved excellent spurious suppression. A low‐noise amplifier (LNA) with a four‐stage single‐ended architecture using a common‐source stage was also developed. This LNA achieved a gain of 20 dB in a band between 83 GHz and 110 GHz and a noise figure lower than 3.8 dB with a frequency of 94 GHz. A W‐band image‐rejection mixer (IRM) with an external off‐chip coupler was also designed. The IRM provided a conversion gain of 13 dB–17 dB for RF frequencies of 80 GHz–110 GHz and image‐rejection ratios of 17 dB–19 dB for RF frequencies of 93 GHz–100 GHz.
ISSN:1225-6463
2233-7326
DOI:10.4218/etrij.2020-0120