온도장 가시화를 위한 연성회로기판을 이용한 온도센서 어레이 제작 및 성능평가

This paper presents the fabrication and performance measurement of a temperature sensor array on a flexible substrate attachable to a curved surface using MEMS technology. Specifically, the fabrication uses the well-developed printed circuit board fabrication technology for complex electrode definition. The temperature sensor array are lifted off with a 10×10 matrix in a 50×50 mm to visualize temperature distribution. Copper is used as temperature sensing material to measure the change in resistances with temperature increase. In a thermal oven with temperature control, the temperature sensor array is characterized. The constant slope of resistance change is obtained and temperature distribution is measured from the relationship between resistance and temperature. KCI Citation Count: 0