Copper Electrode Material using Copper Formate-Bicarbonate Complex for Printed Electronics

Copper ink has been prepared by mixing copper(II) formate and 2-ethyl-1-hexylammonium bicarbonate (EHABC) to overcome some weak points such as aggregation and degradation of copper nano-type ink. Ink was coated on glass substrate and calcined at 110 o C to 150 o C to generate electrically conductive copper film under two different atmospheres such as nitrogen gas and gaseous mixture of formic acid and methanol. The lowest resistivity of 1.88 ㏁·cm of copper film was obtained at 150℃ in gaseous formic acid condition. The long-term resistivity shows to increase from 1.88 ㏁·cm to 2.61㏁·cm after one month. KCI Citation Count: 4