Pressure-Assisted Sinter-Bonding Characteristics at 250 °C in Air Using Bimodal Ag-Coated Cu Particles

To achieve bondlines with improved heat resistance and thermal conductance during operation, pressure-assisted sinter-bonding was performed in air with bimodal Ag-coated Cu particles for die attachment of the next-generation power devices composed of SiC. The bonding temperature and pressure were 250 °C and 10 MPa, respectively, and the sizes of the bimodal particles were 2 µm and 350 nm. After a short bonding time of 10 min, a paste with a 6:4 mixing ratio showed an average shear strength of > 20 MPa. The dewetting of Ag shells on the particles and void filling by the 350 nm particles induced rapid sintering. Graphic Abstract