Finite Element Analysis for Reliability of Solder Joints Materials in the Embedded Package

This paper is about study on warpage, creep strain and the total strain energy density (TSED) effect on fatigue life of the solder joints in the embedded package under thermal cycling conditions by finite element method. In order to investigate the influence of material of solder joints in embedded...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	Electronic materials letters 2019, 15(3), , pp.287-296
Hauptverfasser:	Cho, Seunghyun, Ko, Youngbae
Format:	Artikel
Sprache:	eng
Schlagworte:	Automobile industry Characterization and Evaluation of Materials Chemistry and Materials Science Condensed Matter Physics Cooling Creep (materials) Fatigue life Finite element method Flux density Magnetics and Photonics Materials Science Mathematical analysis Nanotechnology Nanotechnology and Microengineering Optical and Electronic Materials Original Article - Electronics Reliability analysis Soldered joints Thermal cycling Tin base alloys Warpage 전자/정보통신공학
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	This paper is about study on warpage, creep strain and the total strain energy density (TSED) effect on fatigue life of the solder joints in the embedded package under thermal cycling conditions by finite element method. In order to investigate the influence of material of solder joints in embedded package, four materials (SAC305, SnAgCu, Sn96.5Ag3.5, Pb97.5Sn2.5) of solder joints were used. Calculated results show that warpage of package was low, creep strain and TSED of solder joints were low in embedded package. Therefore the fatigue life of the solder joint in embedded package increases. Also, the fatigue life of solder joints of Sn96.5Ag3.5 would be highest among solder materials because of the lowest of TSED. Graphical Abstract
ISSN:	1738-8090 2093-6788
DOI:	10.1007/s13391-019-00122-1