Flip-chip process using heat transfer from an induction-heating film
A new flip-chip technology to attach an IC chip directly to a substrate was studied using the heat transfer from an induction-heating film in an AC magnetic field. When applying a magnetic field of 230 Oe at 14 kHz, the temperature of a 600 μm-thick 5 mm × 5 mm Cu induction-heating film reached 250...
Gespeichert in:
Veröffentlicht in: | Metals and materials international 2009, 15(3), , pp.479-485 |
---|---|
Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A new flip-chip technology to attach an IC chip directly to a substrate was studied using the heat transfer from an induction-heating film in an AC magnetic field. When applying a magnetic field of 230 Oe at 14 kHz, the temperature of a 600 μm-thick 5 mm × 5 mm Cu induction-heating film reached 250 °C within 60 s. The temperature of the glass substrate used in this process was kept below 118 °C at a distance of 1,350 μm from the Cu induction-heating film, which was maintained at 250 °C, implying that damage to a substrate can be minimized with the flip-chip process using heat transfer from an induction-heating film. Flip-chip bonding was successfully accomplished with the reflow of Sn-3.5Ag solder bumps by applying a magnetic field of 230 Oe at 14 kHz for 120 s to a Cu induction-heating film. |
---|---|
ISSN: | 1598-9623 2005-4149 |
DOI: | 10.1007/s12540-009-0479-8 |