Using nano hexagonal boron nitride particles and nano cubic silicon carbide particles to improve the thermal conductivity of electrically conductive adhesives

To satisfy the high electrical and thermal conductivity required for the continuous development of electronic products, nano hexagonal boron nitride (BN) particles and nano cubic silicon carbide (SiC) particles were added into electrically conductive adhesives (ECAs) to improve the thermal conductivity. BN and SiC had little negative effect on the electrical conductivity, but improved the thermal conductivity significantly. When their content was 1.5 wt. %, the thermal conductivity at 100°C, 150°C and 200°C was increased by 71% (100°C), 78% (150°C) and 70% (200°C), and 114% (100°C), 110% (150°C) and 98% (200°C) respectively for BN and SiC comparing with those of the ECAs with no thermal conductive fillers. This method is simple, easy to do, and can be used practically in electronic packaging.