Robust Fuzzy On–Off Synthesis Controller for Maximum Power Point Tracking of Wind Energy Conversion

The need for EMI shielding is becoming more pronounced as it is driven by miniaturization of devices, higher bandwidthof market needs, multiple applications on the same device, and heightened safety concerns with regard to the threat ofelectromagnetism to the health of users. In this paper, we present a reliable method for thin fi lm coating on the surface of amolding compound by nickel and copper plating for EMI shielding applications. The correct adhesion promoter is carefullyselected before proceeding into the plating process. After that, the plated samples were subjected to a series of aging processesfollowing standard industrial compliance, and were found to have passed all the required criteria. The new approachhas several advantages, such as excellent distribution of three-dimensional conformal coating and ease of mass production,which ultimately lowers the cost of production. KCI Citation Count: 0