Three-dimensional Network Structure of Conductive Composites by Hybrid Conductive Fillers of Silver/graphene

In order to explore new generations of interconnecting materials in electronic packaging industries, silver nanoparticles (Ag NPS) and graphene nanosheets (GNS) were introduced into matrix resin to prepare conductive composites. The electrical and mechanical of above electrically conductive adhesives (ECAs) were investigated and characterized. It was found that the ECAs can be solidified through a chemical sintering in the air at 150°C for 30 min. The results indicated that the percolation threshold of resistivity reaches 3.5×10 4 Ω·cm for ECAs filled with 65 wt.% Ag NPS, 0.5 wt.% GNS and the shear strength reaches 10.8 MPa, suggesting excellent electric conductivity and bonding strength.