세라믹 연삭에서 결합제에 따른 다이아몬드 휠의 마멸 특성
In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel during grinding ceramic materials. Normal component of grinding resistance was decreasing while increase of spindle speed. The resistance of vitrified bond wheel was less then...
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| Veröffentlicht in: | 한국생산제조학회지 2002, 11(4), , pp.75-81 |
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| Hauptverfasser: | , , , , , |
| Format: | Artikel |
| Sprache: | kor |
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| Zusammenfassung: | In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel during grinding ceramic materials. Normal component of grinding resistance was decreasing while increase of spindle speed. The resistance of vitrified bond wheel was less then that of resinoid bond wheel because of imbedded large holes on the surface of cutting edge. Surface roughness was decreasing while increase of spindle speed. The surface roughness using vitrified bond wheel was less than that of resinoid bond wheel because of small elastic deformation. After continuous grinding of ceramics, cutting edge ratio of resinoid bond wheel decreased. For the case of vitrified bond wheel, cutting edge ratio did not change. KCI Citation Count: 1 |
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| ISSN: | 2508-5093 2508-5107 |