Implementation of a Radiation-hardened I-gate n-MOSFET and Analysis of its TID(Total Ionizing Dose) Effects
Electronic components that are used in high-level radiation environment require a semiconductor device having a radiation-hardened characteristic. In this paper, we proposed a radiation-hardened I-gate n-MOSFET (n-type Metal Oxide Semiconductors Field Effect Transistors) using a layout modification...
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Veröffentlicht in: | Journal of electrical engineering & technology 2017, 12(4), , pp.1619-1626 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Electronic components that are used in high-level radiation environment require a semiconductor device having a radiation-hardened characteristic. In this paper, we proposed a radiation-hardened I-gate n-MOSFET (n-type Metal Oxide Semiconductors Field Effect Transistors) using a layout modification technique only. The proposed I-gate n-MOSFET structure is modified as an I-shaped gate poly in order to mitigate a radiation-induced leakage current in the standard nMOSFET structure. For verification of its radiation-hardened characteristic, the M&S (Modeling and Simulation) of the 3D (3-Dimension) structure is performed by TCAD (Technology Computer Aided Design) tool. In addition, we carried out an evaluation test using a Co 60 gamma-ray source of 10kGy(Si)/h. As a result, we have confirmed the radiation-hardened level up to a total ionizing dose of 20kGy(Si). KCI Citation Count: 3 |
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ISSN: | 1975-0102 2093-7423 |
DOI: | 10.5370/JEET.2017.12.4.1619 |