Laser-Induced Polymer Removal and Transmittance Enhancement of an Indium-Tin-Oxide (ITO) Film by Reduction of Surface Roughness
The stripping of the photoresist (PR) layer on a silicon wafer and transmittance enhancement of an indium-tin-oxide (ITO) film was investigated by irradiation with the line beam of a KrF excimer laser with a wavelength of 248 nm. A 0.82-μm-thick PR layer was removed perfectly at an energy density of...
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Veröffentlicht in: | Journal of the Korean Physical Society 2006, 49(1), , pp.393-400 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The stripping of the photoresist (PR) layer on a silicon wafer and transmittance enhancement
of an indium-tin-oxide (ITO) film was investigated by irradiation with the line beam of a KrF
excimer laser with a wavelength of 248 nm. A 0.82-μm-thick PR layer was removed perfectly at
an energy density of 300 mJ/cm2 after a 6-pulse irradiation with the line beam without the aid of
any chemical or solvent. The ablation rates were 0.06 μm/pulse for 100 mJ/cm2, 0.10 μm/pulse for
200 mJ/cm2 and 0.13 μm/pulse for 300 mJ/cm2. Many application fields require materials with
optically smooth surfaces. A non-contact optical polishing method with a line beam technology
is introduced and discussed for reducing the ITO surface roughness with angstrom (°A) precision
without any pre- or post-treatment with chemicals. The transmission spectra of the ITO film before
and after line beam irradiation showed an enhanced transmittance of over 8 % in the visible region
(400 800 nm). The effects of the excimer laser’s fluence and the number of pulses applied to the
ITO surface on reducing the surface roughness were investigated. The root-mean-square (RMS)
roughness of the ITO film was decreased by 30 37 % compared to the initial laser-untreated ITO
surface roughness. The main reason for the enhanced transmittance of the ITO film is the reduction
of the ITO surface roughness, which reduces light scattering at the surface of the ITO. Non-contact
laser technology has shown the ability to strip the PR without any pre- or post-chemical process
and without any substrate damage. KCI Citation Count: 5 |
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ISSN: | 0374-4884 1976-8524 |