Electrical Resistivities and TCR Behavior of Co-Sputtered TaN-(Ag, Cu) Nanocomposites
The motivation for this study arose from the potential to control electrical properties, such as the resistivity and the TCR, by fabricating TaN-metal nanocomposite films with electron scattering by nanoparticles in the tantalum-nitride matrix. The present work investigated the correlation between t...
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| Veröffentlicht in: | Journal of the Korean Physical Society 2009, 54(6), , pp.2323-2326 |
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| Hauptverfasser: | , , , , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
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| Zusammenfassung: | The motivation for this study arose from the potential to control electrical properties, such as the resistivity and the TCR, by fabricating TaN-metal nanocomposite films with electron scattering by nanoparticles in the tantalum-nitride matrix. The present work investigated the correlation between the electrical properties and the microstructures of the nanocomposite films. Co-deposited TaN-Ag and TaN-Cu nanocomposite thin films under a 55 % N2 partial pressure at a Ta power density of 8.78 W/cm2 and at various Ag and Cu power densities were generated. KCI Citation Count: 2 |
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| ISSN: | 0374-4884 1976-8524 |
| DOI: | 10.3938/jkps.54.2323 |