Hot-Cracking Mitigation and Microcrack Formation Mechanisms in Laser Powder Bed Fusion Processed Hastelloy X and Cantor High Entropy Alloys
The microcrack formation mechanisms and mitigation strategies were thoroughly investigated and explained in Hastelloy X samples fabricated via Laser Powder Bed Fusion (LPBF) with varying printing parameters and geometries. The microstructure evolution regarding microcrack formation is comprehensivel...
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Veröffentlicht in: | Metals and materials international 2024, 30(12), , pp.3370-3378 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The microcrack formation mechanisms and mitigation strategies were thoroughly investigated and explained in Hastelloy X samples fabricated via Laser Powder Bed Fusion (LPBF) with varying printing parameters and geometries. The microstructure evolution regarding microcrack formation is comprehensively examined in conjunction with thermal residual stresses affected by process parameters (e.g., laser power, scan velocity determining volumetric energy density,
VED
), proximity to build/substrate interface, and print section aspect ratio. Results indicated for microcracks to form in Hastelloy X, the
VED
must exceed the critical value of ~ 114 J/mm3, below which the lack-of-fusion porosity persists, thereby highlighting a trade-off with densification. Similar trends were also observed for a Cantor high-entropy alloy. Higher residual stresses near the print/substrate interface increase susceptibility to hot-cracking, leading to a higher density of microcracks at lower build heights along the Z-axis. A higher aspect ratio of the print section can further intensify the residual stresses, thus contributing to a higher density of microcracks as well as warpage in the bar sample. Finally, SEM observations and quantitative EBSD analysis establish a strong correlation between microcrack susceptibility, grain coarsening, and a Z-aligned grain/crystallographic texture, especially at higher
VED
s or closer to the substrate. These findings provide insights for mitigating microcrack evolution and refining LPBF processes.
Graphical Abstract |
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ISSN: | 1598-9623 2005-4149 |
DOI: | 10.1007/s12540-024-01711-y |