전산유동가시화를 활용한 웨이퍼 이송장치의 복사열전달에 관한 연구

The high heat emitted from the process module and heat jacket may cause errors in semiconductor process equipment. Barriers were designed to reduce the temperature of surface on transfer module. A designed barrier was compared and analyzed by numerical analysis using ANSYS Fluent. The average temperature of barrier and effect of radiation heat transfer were also compared through absorbed radiative heat flux of the barrier. The adoption of the barrier had an effect on the radiative heat transfer reduction of the transfer module rod. The effect of the angles of barrier from 50° to 90° on the heat transfer was investigated using the absorbed radiative heat flux with the average temperature. The angle of barrier of 50° reduced the temperature up to 9.6 %.