A process for preparing an assembly of an article and a soluble polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature

A process for preparing an assembly of an article and a soluble polyimide which resists dimensional change, delamination, and debonding when exposed to changes in temperature

An assembly of an article and a polyimide is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A soluble polyimide resin solution having a low coefficient of thermal expansion (CTE) was prepared by dissolving...

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Bibliographische Detailangaben
Hauptverfasser: Stoakley, Diane M., St.clair, Anne K.
Format: Report
Sprache:eng
Schlagworte:
Nonmetallic Materials
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Beschreibung
Zusammenfassung:An assembly of an article and a polyimide is prepared. The assembly resists dimensional change, delamination, or debonding when exposed to changes in temperature. An article is provided. A soluble polyimide resin solution having a low coefficient of thermal expansion (CTE) was prepared by dissolving the polyimide in solvent and adding a metal ion-containing additive to the solution. Examples of the additive are: Ho(OOCCH3), Er(NPPA)3, TmCl3, and Er(C5H7O2)3. The soluble polyimide resin is combined with the article to form the assembly.