How additives affect Cu electrodeposition : an electrochemical STM Study

How additives affect Cu electrodeposition : an electrochemical STM Study

A study of the effect of chloride and sulfate anions, as well as of SPS molecules on Cu electrodeposition is presented in this thesis. The deposition process was analyzed by means of a home-built fast electrochemical STM in situ after and during deposition.

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Bibliographische Detailangaben
1. Verfasser: Yanson, Y.I.
Format: Dissertation
Sprache:eng
Schlagworte:
Accelerator
Additives
Chloride
Copper
Electrodeposition
STM
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Beschreibung
Zusammenfassung:A study of the effect of chloride and sulfate anions, as well as of SPS molecules on Cu electrodeposition is presented in this thesis. The deposition process was analyzed by means of a home-built fast electrochemical STM in situ after and during deposition.