Single- and multilayer graphene wires as alternative interconnects
© 2016 Elsevier B.V. All rights reserved. In this work, we evaluate the material properties of graphene and assess the potential application of graphene to replace copper wires in Back-End-Of-Line (BEOL) interconnects. Based on circuit and system-level simulations, high restrictions are imposed to g...
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Veröffentlicht in: | Microelectronic Engineering 2016, Vol.156, p.131-135 |
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Hauptverfasser: | , , , , , , , , , , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | © 2016 Elsevier B.V. All rights reserved. In this work, we evaluate the material properties of graphene and assess the potential application of graphene to replace copper wires in Back-End-Of-Line (BEOL) interconnects. Based on circuit and system-level simulations, high restrictions are imposed to graphene with respect to contact resistance and mean free path. Experimentally we evaluate single and multi-layer graphene wires and we measure carrier mean free paths (MFPs) above ∼ 110 nm. However, contact engineering will be the key issue for integration of graphene as interconnect. |
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ISSN: | 0167-9317 |