Single- and multilayer graphene wires as alternative interconnects

© 2016 Elsevier B.V. All rights reserved. In this work, we evaluate the material properties of graphene and assess the potential application of graphene to replace copper wires in Back-End-Of-Line (BEOL) interconnects. Based on circuit and system-level simulations, high restrictions are imposed to g...

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Veröffentlicht in:Microelectronic Engineering 2016, Vol.156, p.131-135
Hauptverfasser: Politou, Maria, Asselberghs, Inge, Soree, Bart, Lee, Chang Seung, Sayan, Safak, Lin, Dennis, Pashaei, Parham, Huyghebaert, Cedric, Raghavan, Praveen, Radu, Iuliana, Tokei, Zsolt, De Gendt, Stefan, Heyns, Marc
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Sprache:eng
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Zusammenfassung:© 2016 Elsevier B.V. All rights reserved. In this work, we evaluate the material properties of graphene and assess the potential application of graphene to replace copper wires in Back-End-Of-Line (BEOL) interconnects. Based on circuit and system-level simulations, high restrictions are imposed to graphene with respect to contact resistance and mean free path. Experimentally we evaluate single and multi-layer graphene wires and we measure carrier mean free paths (MFPs) above ∼ 110 nm. However, contact engineering will be the key issue for integration of graphene as interconnect.
ISSN:0167-9317