Advanced Interconnects: Materials, Processing, and Reliability

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Veröffentlicht in:ECS Journal of Solid State Science and Technology 2015, Vol.4 (1), p.Y1-Y4
Hauptverfasser: Baklanov, Mikhail R, Adelmann, Christoph, Zhao, Larry, De Gendt, Stefan
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Sprache:eng
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container_issue 1
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container_title ECS Journal of Solid State Science and Technology
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creator Baklanov, Mikhail R
Adelmann, Christoph
Zhao, Larry
De Gendt, Stefan
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source Lirias (KU Leuven Association); IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link
title Advanced Interconnects: Materials, Processing, and Reliability
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