Advanced Interconnects: Materials, Processing, and Reliability
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Veröffentlicht in: | ECS Journal of Solid State Science and Technology 2015, Vol.4 (1), p.Y1-Y4 |
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container_title | ECS Journal of Solid State Science and Technology |
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creator | Baklanov, Mikhail R Adelmann, Christoph Zhao, Larry De Gendt, Stefan |
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identifier | ISSN: 2162-8769 |
ispartof | ECS Journal of Solid State Science and Technology, 2015, Vol.4 (1), p.Y1-Y4 |
issn | 2162-8769 |
language | eng |
recordid | cdi_kuleuven_dspace_123456789_502315 |
source | Lirias (KU Leuven Association); IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link |
title | Advanced Interconnects: Materials, Processing, and Reliability |
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