An electromagnetic valve for two-phase cooling of microelectronic circuits

This paper reports on the design, optimization and testing of an electromagnetic valve for controlling two-phase cooling through heat sinks for microelectronic circuits. A response time below 10 ms makes it suitable for the fast dynamics of bubble formation inside heat sinks. The main valve is driven by a pilot valve to reduce the required actuation force. It is designed to cope with up to 6 bar absolute system pressure and up to 1 bar differential pressure at maximum flow rates of 4 g/s (15 kg/h) required to remove a heat flux of 500 W/cm2.