Growth of Vertically Aligned CNTs with Ultra Thin Ni Catalysts
We report on the growth mechanism of vertically aligned carbon nanotubes (VACNTs) using ultra thin Ni catalysts and direct current plasma enhanced chemical vapor deposition (PECVD) system. The CNTs were grown with -600 V bias to substrate electrode and catalyst thickness variation of 0.07 nm to 3 nm...
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Veröffentlicht in: | Transactions on electrical and electronic materials 2008-04, Vol.9 (2), p.62-66 |
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Hauptverfasser: | , , , , , |
Format: | Artikel |
Sprache: | kor |
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Zusammenfassung: | We report on the growth mechanism of vertically aligned carbon nanotubes (VACNTs) using ultra thin Ni catalysts and direct current plasma enhanced chemical vapor deposition (PECVD) system. The CNTs were grown with -600 V bias to substrate electrode and catalyst thickness variation of 0.07 nm to 3 nm. The CNT density was reduced with catalyst thickness reduction and increased growth time. Cone like CNTs were grown with ultra thin Ni thickness, and it results from an etch of carbon network by reactive etchant species and continuous carbon precipitation on CNT walls. Vertically aligned sparse CNTs can be grown with ultra thin Ni catalyst. |
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ISSN: | 1229-7607 2092-7592 |