Electronic Packaging Needs Met by Three Dimensional Molded Interconnection Packages

Electronic Packaging Needs Met by Three Dimensional Molded Interconnection Packages

Recent developments in plating and imaging of circuit patterns on three dimensional shapes have made it possible to apply electronic circuitry directly to the surface of a molded plastic part of complex configuration. Thus both mechanical and electrical functionality can be combined in a single low...

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Veröffentlicht in:SAE transactions 1987-01, Vol.96, p.507-513
Hauptverfasser: Mettler, Jack, Bright, Jim, Impey, John
Format: Artikel
Sprache:eng
Schlagworte:
Capital costs
Circuit boards
Imaging
Manufacturing processes
Material films
Packaging
Printed circuits
Resins
Screen process printing
Solders
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Beschreibung
Zusammenfassung:Recent developments in plating and imaging of circuit patterns on three dimensional shapes have made it possible to apply electronic circuitry directly to the surface of a molded plastic part of complex configuration. Thus both mechanical and electrical functionality can be combined in a single low cost component. The paper reviews the state of the art of this Molded Interconnection Packaging Technology, describing advantages and limitations and offering examples of specific designs.
ISSN:0096-736X