Characteristics of passive Taresistive planes embedded in Alsheet PCB compatible for integrated MCMsubstrates or packaging carriers

Recent progress in the investigation of the material parameters of AlAl2O3systems leads to an increase in the possibilities for using embedded TaOXN1X layers. The use of Alsheets as mechanical strength carriers in combination with vacuumdeposited Allayers and electrochemically anodized Al2O3 structu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Microelectronics international 1999-04, Vol.16 (1), p.18-20
Hauptverfasser:	Ivanov Philippov, Philip, Markova Rassovska, Milka, Georgiev Arnaudov, Radosvet, Angelov Ianev, Vassil, Draganova Gospodinova, Minka
Format:	Artikel
Sprache:	eng
Schlagworte:	Aluminium Multichip model Multilayers Packaging
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!