Assembly of flexible RFID tag inlays with anisotropic conductive paste ACP

Purpose The purpose of this paper is to accomplish the low cost massproduction of flexible radio frequency identification RFID tag inlays. Designmethodologyapproach An anisotropic conductive paste ACP is prepared by mixing uniform microsized spherical conductive particles, latent curing agent and other additives into a thermoset epoxy resin. RFID tag inlays are assembled with the paste through flipchip technology. The microstructural analysis of bonded joints, bond strength testing, and hightemperature and humidity aging testing are employed to evaluate the performance of the inlays. Findings It was found that the chips are hard assembled on the antennae by the ACP. Flexible RFID tag inlays assembled using the presented method have good reliability when working under high frequency 13.56MHz conditions. Research limitationsimplications The method presented is a promising new way for packaging flexible RFID tag inlays with ACP. Through the use of flipchip technology, largescale production is possible with low manufacturing costs. Originalityvalue The paper details a simple way to prepare an anisotropic conductive paste and to assemble flexible RFID tag inlays. The technique uses flipchip technology with the paste as the electrical and mechanical interconnection material. It presents a simple and fast method of assembly for flexible RFID tag inlays on a largescale with low cost.