RFMEMS switches on a printed circuit board platform

Purpose The purpose of this paper is to present a new class of printed circuit board PCBbased, radio frequency microelectromechanical systems RFMEMS switches and to describe the packaging method and evaluate performance. Designmethodologyapproach Traditional PCB materials and processes were combined with photolithographic highdensity interconnect HDI and MEMS to form 3D highperformance RF switches. Findings A new type of MEMS RF switch has been developed on a PCB platform. Using processes analogous to those used for silicon MEMS, PCB, and HDI technologies were utilized to fabricate these 3D structures. The PCBbased microstructures are milscale rather than the microscale of silicon MEMs. A cofabrication packaging method for the MEMS RF switch was also developed. The PCBbased MEMS switches have demonstrated excellent RF performance and hotswitching RF powerhandling capability. PCBbased MEMS RF switches have the advantages of low cost and amenability to scaleup for a high degree of integration. Research limitationsimplications Further development on photo imageable dielectric materials will enable this technology to improve yield and processability. Originalityvalue The paper describes the development of PCBbased MEMS RF switches. These elements will enable new applications and enhance the functionality of PCBs. They are also more amenable to system integration compared with silicon MEMS.