Nano and microfilled conducting adhesives for zaxis interconnections new direction for highspeed, highdensity, organic microelectronics packaging

Purpose The purpose of this paper is to discuss the use of epoxybased conducting adhesives in zaxis interconnections. Designmethodologyapproach A variety of conductive adhesives with particle sizes ranging from 80nm to 15m were laminated into printed wiring board substrates. SEM and optical microsco...

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Veröffentlicht in:	Circuit world 2008-02, Vol.34 (1), p.3-12
Hauptverfasser:	Das, Rabindra N., Egitto, Frank D., Markovich, Voya R.
Format:	Artikel
Sprache:	eng
Schlagworte:	Adhesives Electronic engineering Printed circuits Semiconductor devices
Online-Zugang:	Volltext
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