Design, materials and process for leadfree assembly of highdensity packages

Design, materials and process for leadfree assembly of highdensity packages

The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of highdensity packages using leadfree solder. The design, material, and assembly process aspects of the project are addressed in this paper. The components studied include many surface mount technol...

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Veröffentlicht in:Soldering & surface mount technology 2004-04, Vol.16 (1), p.53-62
Hauptverfasser: Smetana, Joe, Horsley, Rob, Lau, John, Snowdon, Ken, Shangguan, Dongkai, Gleason, Jerry, Memis, Irv, Love, Dave, Dauksher, Walter, Sullivan, Bob
Format: Artikel
Sprache:eng
Schlagworte:
Design for assembly
Packaging materials
Printedcircuit boards
Soldering
Surface fitting
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Beschreibung
Zusammenfassung:The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of highdensity packages using leadfree solder. The design, material, and assembly process aspects of the project are addressed in this paper. The components studied include many surface mount technology package types, various lead, and printed circuit board finishes and pasteinhole assembly.
ISSN:0954-0911
DOI:10.1108/09540910410517068