(Best Paper Award) Aluminum Josephson Junction Formation on 200mm Wafers Using Different Oxidation Techniques
For superconducting quantum circuits with a large number of Qubits, reproducible components are crucial for reducing entanglement decoherence. Particularly for reliable industrial manufacturing on full-scale 200 mm' wafers, a very high uniformity level is required to ensure sufficient coherence...
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Veröffentlicht in: | Meeting abstracts (Electrochemical Society) 2023-08, Vol.MA2023-01 (29), p.1791-1791 |
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Sprache: | eng |
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Zusammenfassung: | For superconducting quantum circuits with a large number of Qubits, reproducible components are crucial for reducing entanglement decoherence. Particularly for reliable industrial manufacturing on full-scale 200 mm' wafers, a very high uniformity level is required to ensure sufficient coherence times. In the present work the special focus was put on manufacturing
Al/AlO
x
/Al
Josephson junctions (JJ), which are the most important component of many quantum circuit. Fully
Al
-based CMOS-compatible JJ’s were produced using a double dry etch process. After patterning the first
Al
metallization several oxidation processes have been investigated.
Static oxidation has been performed by first removing the native
AlOx
in a multi-chamber system with
Ar
milling. The final tunneling oxide was controlled by applying a specific pressure in the chamber under a pure O2 atmosphere. Afterwards, without breaking the vacuum, the second
Al
metallization has been deposited by sputtering. Oxide thicknesses between 1 and 2.5 nm were achieved. A full mapping of the process homogeneity will be given.
On the other hand, a dynamic recipe controlled plasma oxidation process was performed, where the native
AlO
x
was first removed by a
H
2
plasma followed by a defined reoxidation with an oxygen plasma. The resulting oxides had thicknesses up to 10 nm. The second
Al
metallization was again deposited by sputtering.
Both oxidation processes were carefully studied to understand the initial oxidation process of the aluminum surface. Special attention was devoted to the non-destructive removal of the native
AlOx
with respect to the
Al
interface. Because the oxide thicknesses varied between 1 and 10 nm, the transition between direct and Fowler-Nordheim tunneling could be investigated. The process-stability on full scale 200 mm wafers and on chip size could be determined via test structures as well as the resistance variation of the Josephson junctions. Furthermore, the electrical properties of the different oxides could be measured and analyzed on wafer level. These studies provide insight into the structure and composition of the aluminum oxides and the applicability for Qubits. |
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ISSN: | 2151-2043 2151-2035 |
DOI: | 10.1149/MA2023-01291791mtgabs |