Time-Dependent Evolution Study of Ar/N2 Plasma-Activated Cu Surface for Enabling Two-Step Cu-Cu Direct Bonding in a Non-Vacuum Environment

Time-Dependent Evolution Study of Ar/N2 Plasma-Activated Cu Surface for Enabling Two-Step Cu-Cu Direct Bonding in a Non-Vacuum Environment

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Veröffentlicht in:ECS journal of solid state science and technology 2021-12, Vol.10 (12)
Hauptverfasser: Hu, Liangxing, Goh, Simon Chun Kiat, Tao, Jing, Lim, Yu Dian, Zhao, Peng, Lim, Michael Joo Zhong, Salim, Teddy, Velayutham, Uvarajan M, Tan, Chuan Seng
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container_issue 12
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container_title ECS journal of solid state science and technology
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creator Hu, Liangxing
Goh, Simon Chun Kiat
Tao, Jing
Lim, Yu Dian
Zhao, Peng
Lim, Michael Joo Zhong
Salim, Teddy
Velayutham, Uvarajan M
Tan, Chuan Seng
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doi_str_mv 10.1149/2162-8777/ac3b8e
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title Time-Dependent Evolution Study of Ar/N2 Plasma-Activated Cu Surface for Enabling Two-Step Cu-Cu Direct Bonding in a Non-Vacuum Environment
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