Multi Beam Grooving and Full Cut Laser Dicing of IC Wafers

This paper will discuss the multiple beam laser dicing technology, an enabling technology that allows semiconductor manufacturers to execute the technology roadmap and continue to comply to Moore's law in an efficient manner. The multiple beam laser dicing technology has already been widely adopted by several other semiconductor technologies (e.g. RFIC, LED, T&D) and has a proven track record. The paper will address how the grooving profile generated by the multi beams give a similar or better performance compared to the single beam grooving profiles. Together with large IDM's ALSI has done an evaluation of the saw blade yield for various grooving technologies. During the conference we will present the results which will demonstrate an equal or better saw yield with a high productivity.