Development of Post-CMP Cleaners for Better Defect Performance

In the copper CMP process, organic residues that are related to Benzotriazole (BTA) adsorbed on copper surface after Cu CMP process have to be removed during the cleaning. In order to address this organic defect issue, we present here the study of the performance of BTA removal by post-CMP cleaners...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Tran, Cuong, Zhang, Peng, Sun, Laisheng, Penta, Naresh K., Lagudu, Uma Rames K., Shipp, Devon, Babu, S.V
Format:	Tagungsbericht
Sprache:	eng
Online-Zugang:	Volltext
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