Development of Post-CMP Cleaners for Better Defect Performance

In the copper CMP process, organic residues that are related to Benzotriazole (BTA) adsorbed on copper surface after Cu CMP process have to be removed during the cleaning. In order to address this organic defect issue, we present here the study of the performance of BTA removal by post-CMP cleaners using copper particles as substrates instead of copper wafers. In this work, different copper particles including Cu(0), Cu(I) and Cu(II) oxide particles with high surface area, were chosen to study the removal of BTA adsorbed on different copper states. TGA and UV-Vis spectra were used to detect and quantify the BTA removal efficiency. The results by different post CMP cleaners on various Cu particles will be presented.