Contact Resistivity of Highly Doped Si:P, Si:As, and Si:P:As Epi Layers for Source/Drain Epitaxy

In this work we report on the contact resistivity of highly doped epitaxial Si:P, Si:As and Si:P:As layers grown on 300 mm Si (100) substrates. The contact resistivity was extracted using a Multi-Ring Circular Transmission Line Model for a Ti based contacting scheme. Both selective and non-selective...

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Veröffentlicht in:ECS transactions 2020-09, Vol.98 (5), p.37-42
Hauptverfasser: Rosseel, Erik, Porret, Clement, Hikavyy, Andriy Yakovitch, Loo, Roger, Tirrito, Matteo, Douhard, Bastien, Richard, Olivier, Horiguchi, Naoto, Khazaka, Rami
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Sprache:eng
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Zusammenfassung:In this work we report on the contact resistivity of highly doped epitaxial Si:P, Si:As and Si:P:As layers grown on 300 mm Si (100) substrates. The contact resistivity was extracted using a Multi-Ring Circular Transmission Line Model for a Ti based contacting scheme. Both selective and non-selective epitaxy processes were used and the effect of a post-epitaxy millisecond laser anneal was studied. Excellent contact resistivities down to ~2E-9 Ohm.cm2 could be found at high doping levels. A clear correlation was observed between the resistivity/contact resistivity and activation levels obtained by micro-Hall measurements. Although As doping is not bringing substantially lower contact resistivities compared to P doping, we observe a small beneficial effect. As also remains an attractive dopant for extension liners because of its lower diffusion constant.
ISSN:1938-5862
1938-6737
DOI:10.1149/09805.0037ecst