Single-flux-quantum circuits utilizing self-shunted NbN/TaN/NbN Josephson junctions grown on silicon substrates
We report on the electrical properties of NbN/TaN/NbN Josephson junctions grown on thermally oxidized silicon substrates, along with the design and fabrication of superconducting single-flux-quantum (SFQ) circuits based on these NbN superconductor/normal metal/superconductor (SNS) junctions. The cri...
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Veröffentlicht in: | Superconductor science & technology 2024-11, Vol.37 (11), p.115020 |
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Sprache: | eng |
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Zusammenfassung: | We report on the electrical properties of NbN/TaN/NbN Josephson junctions grown on thermally oxidized silicon substrates, along with the design and fabrication of superconducting single-flux-quantum (SFQ) circuits based on these NbN superconductor/normal metal/superconductor (SNS) junctions. The critical current density ( J c ) of the junctions was found to be relatively sensitive to the barrier thickness, decreasing from 108.0 ± 8.1 kA cm −2 for a 15 nm barrier to 12.8 ± 1.9 kA cm −2 for a 30 nm barrier. For a J c of approximately 24.5 ± 2.1 kA cm −2 and a barrier thickness of 25 nm, the NbN SNS junctions are self-shunted and exhibit nonhysteretic current–voltage ( I – V ) characteristics. Especially for junctions with diameter ( φ ) ranging from 0.8 to 1.6 μ m, their critical current ( I c ) falls within the range of 110–450 μ A, making them suitable for SFQ circuits. By considering the impact of excess current and incorporating it as an additional term in the conventional resistively and capacitively shunted junction model, the I – V curves of NbN SNS junctions can be precisely described, successfully minimizing the deviation between simulations and test results. The DC-SFQ and SFQ-DC interface circuits can both operate normally, and the bias margins of cell circuits such as Josephson transmission line, confluence buffer, D flip-flop, and splitter are greater than 40%. Compared to Nb superconductor/insulator/superconductor junctions, their self-shunting characteristics and relatively thick 25 nm barriers can also enhance the integration of circuits and increase the yield to complex circuits. |
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ISSN: | 0953-2048 1361-6668 |
DOI: | 10.1088/1361-6668/ad83ad |