Effect of Zn addition and Ti doping position on the diffusion reaction of internal tin Nb3Sn conductors

Addition of Zn to a Cu matrix during Cu-Zn/Sn interdiffusion reactions at 400 °C leads to the formation of a solid ternary Cu-Zn-Sn phase, β-CuZn, at the outermost reaction layer next to the porous phase. The use of a brass matrix considerably suppresses void formation and promotes homogeneous outwa...

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Veröffentlicht in:	Superconductor science & technology 2019-10, Vol.32 (11)
Hauptverfasser:	Banno, Nobuya, Morita, Taro, Yu, Zhou, Yagai, Tsuyoshi, Tachikawa, Kyoji
Format:	Artikel
Sprache:	eng
Schlagworte:	atom probe tomography brass matrix growth kinetics Ti doping void
Online-Zugang:	Volltext
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