High-performance HZO/InAlN/GaN MISHEMTs for Ka-band application

This paper reports on the demonstration of microwave power performance at 30 GHz on InAlN/GaN metal–insulator–semiconductor high electron mobility transistor (MISHEMT) on silicon substrate by using the Hf 0.5 Zr 0.5 O 2 (HZO) as a gate dielectric. Compared with Schottky gate HEMT, the MISHEMT with a...

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Veröffentlicht in:Semiconductor science and technology 2023-03, Vol.38 (3), p.35011
Hauptverfasser: Cui, Peng, Moser, Neil, Chen, Hang, Xiao, John Q, Chabak, Kelson D, Zeng, Yuping
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Sprache:eng
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Zusammenfassung:This paper reports on the demonstration of microwave power performance at 30 GHz on InAlN/GaN metal–insulator–semiconductor high electron mobility transistor (MISHEMT) on silicon substrate by using the Hf 0.5 Zr 0.5 O 2 (HZO) as a gate dielectric. Compared with Schottky gate HEMT, the MISHEMT with a gate length ( L G ) of 50 nm presents a significantly enhanced performance with an ON/OFF current ratio ( I ON / I OFF ) of 9.3 × 10 7 , a subthreshold swing of 130 mV dec −1 , a low drain-induced barrier lowing of 45 mV V −1 , and a breakdown voltage of 35 V. RF characterizations reveal a current gain cutoff frequency ( f T ) of 155 GHz and a maximum oscillation frequency ( f max ) of 250 GHz, resulting in high ( f T × f max ) 1/2 of 197 GHz and the record high Johnson’s figure-of-merit (JFOM = f T × BV) of 5.4 THz V among the reported GaN MISHEMTs on Si. The power performance at 30 GHz exhibits a maximum output power of 1.36 W mm −1 , a maximum power gain of 12.3 dB, and a peak power-added efficiency of 21%, demonstrating the great potential of HZO/InAlN/GaN MISHEMTs for the Ka-band application.
ISSN:0268-1242
1361-6641
DOI:10.1088/1361-6641/acb2ea