A high-resolution study of the electrical resistivity of thin noble-metal foils

Results of the first ultra-high-resolution studies of the low-temperature electrical resistivity of thin metal foils are reported. 10 and 25 μm thickness high-purity foils of Ag and Au, and a single 25 μm foil of Cu have been measured over the temperature range 1·2 to 8 K. In all the foils, surface scattering was the dominant resistive mechanism. For all three metals the temperature dependence of the resistivity in the foils appears to be almost the same as that of bulk material having the same residual resistivity. Thus there is no evidence of an additional temperature dependence arising solely from the presence of the surface.