Editorial
As 2022 draws to a close, I recently had the pleasant task of updating our Steering Committee on TSM's situation at the end of another year. Our impact factor for 2021, the most recent data available, remains high, at 2.795, comparable to that of journals handling a much larger volume of papers...
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Veröffentlicht in: | IEEE transactions on semiconductor manufacturing 2022-11, Vol.35 (4), p.595-595 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | As 2022 draws to a close, I recently had the pleasant task of updating our Steering Committee on TSM's situation at the end of another year. Our impact factor for 2021, the most recent data available, remains high, at 2.795, comparable to that of journals handling a much larger volume of papers than ours. This is a significant improvement from 1.18 in 2018, and one for which the entire TSM community-the staff, the Editorial Board, the reviewers, but especially the authors-should feel justifiably proud. Our financial situation is strong, our page count is growing, and our mean time to first review remains below ten weeks. We must continue to maintain and improve our performance, but we can look back on a year of solid progress. |
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ISSN: | 0894-6507 1558-2345 |
DOI: | 10.1109/TSM.2022.3213385 |